sputtering equipment meaning in Chinese
溅镀设备
溅射镀膜装置
溅涂装置
Examples
- General specification for magnetic sputtering equipment
磁控溅射设备通用技术条件 - Plasma sputtering equipment
等离子溅射设备 - Using jgp560c magnetron sputtering equipment , cu / ag film are deposited on cd1 - xznxte substrate by dc magnetron sputtering in order to get the influences of the main experiments parameters such as sputtering power , gas flow , vacuum air pressure , magnetoelectricity power and substrate temperature on deposition rate of film , discovered that dc sputtering power is the most key factor influencing the deposition rate
在jgp560c型超高真空多功能磁控溅射镀膜机上，采用直流磁控溅射法在cdznte晶体上制备出cu ag合金薄膜，揭示了气体流量、直流溅射功率、励磁电源功率、工作气压和衬底温度等工艺参数对沉积速率的影响规律。结果表明溅射功率对沉积速率的影响最大，随溅射功率的增大沉积速率快速增大。